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Copper Foil sputtered Graphite Thermal Film
High-efficiency heat dissipation and EMI electromagnetic shielding solution
- Copper Foil sputtered Graphite Thermal Film is a multi-functional material that integrates heat dissipation, uniform temperature and EMI electromagnetic shielding.
- It is an ideal alternative to heat dissipation copper foil and artificial graphite.
- Not only does this material have excellent thermal conductivity, it can also effectively replace electromagnetic shielding copper foil while providing a cooling effect.
Copper Foil sputtered Graphite Thermal Film
Product structure
nano-grade graphite
Copper foil
Product Introduction:
Key Features & Benefits
Superior Heat Dissipation
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Functions as a cost-effective alternative to traditional copper foil and artificial graphite sheets.
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Offers dual-mode heat transfer through thermal conduction and radiation, enhancing overall system cooling.
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Achieves temperature drops of 4°C to 11°C depending on application area, copper thickness, and tape used.
Enhanced Thermal Performance
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Ensures temperature uniformity, reducing hotspots more effectively than expensive synthetic graphite flakes.
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Suitable for LED applications, helping to:
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Improve brightness
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Maintain stable luminance
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Reduce light decay
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Relieve thermal interface stress
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EMI Shielding & Conductivity
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Can replace conventional EMI shielding copper foil thanks to its excellent thermal and electrical conductivity.
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Provides simultaneous cooling and shielding in high-frequency applications.
DLC Coating Technology (Diamond-Like Carbon)
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Applied via PVD sputtering, graphite carbon atoms are deposited on the copper surface forming a DLC layer.
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Benefits of DLC-treated copper foil:
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Improved thermal expansion control
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Relief of chip packaging stress
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Increased surface hardness & wear resistance
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Lower surface reflectivity
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Ultra-Thin & Flexible Design
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Thickness < 0.1mm and lightweight—ideal for space-constrained or non-ventilated systems.
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Bend-resistant and flake-proof, outperforming standard graphite films.
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Compatible with insulation adhesive processes for application flexibility.
Technical Advantages
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Roll-to-Roll sputtering process ensures consistent nano-scale graphite deposition without any adhesive layers, enhancing thermal transfer efficiency.
- DLC surface treatment makes the film suitable for high-reliability and long-lifespan electronic components.
Typical Applications
- LED lighting systems
- Solid State Drive
- High-power microelectronic modules
- Smartphones and tablets PC
- Fanless thermal management systems
- EMI shielding for sensitive components
- Automotive electronics
How to use:
1. Attach the copper foil to the heat source, the heat will be quickly conducted to the graphite surface through the high longitudinal thermal conductivity of the copper foil
2. At this time, the carbon atoms of the sputtered nano-scale graphite distribute the heat energy evenly due to its high thermal radiation efficiency.
Because the material itself is conductive, it is suitable for heat dissipation products that do not require insulation. - If there is a need for electrical insulation, it is recommended to use it with Mylar sheets.
In order to achieve good results, please attach the double-sided tape tightly to the copper foil side and the heat source side. Our materials are recommended to be used on heat sources with flat surfaces, as the heat dissipation effect will be better.
*We have a comparison table of thermal conductive materials-Copper Foil sputtered Graphite Thermal Film VS artificial graphite. Please click the bottom line link in front to watch.
*We have done a heat dissipation experiment: Comparing the cooling effect of 100um copper foil vs 100um graphite copper foil, you can click on the bottom line on the left to watch.
*Measured data on LED backlight heat dissipation and brightness improvement.
*Introduction of DLC diamond-like carbon film
It is recommended to use ultra-thin thermally conductive double-sided tape for bonding (10~30um, the thinner the glue, the better the effect of graphite copper foil)
Applications:
-Heat Spreaders for LSI packages
-Base plates for power semiconductor modules,LEDs,Amplifiers
Suitable for all kinds of electronic products that require flat temperature uniformity or heat dissipation, e.g.,Smartphone,Tablet,Laptop,CPU,GPU,Adaptor,Backlight Module,Display,LED TV...
*Interested in the product, please contact us Email: joe_lin@topnano.com.tw (Mr. Lin)*
Shipping Specifications:
-All the products are with Single Side graphite
-Roll width: 500mmItem No. Copper foil thickness
( um )GOS035NY5-P01 35 GOS070NY4-P01 70 GOS100NY7-P01 100 GOS140NY8-P01 140
**Basically, the larger the area of this material or the thicker the copper thickness you use, the better the temperature uniformity and heat dissipation effect.
**Sputtered graphite on both sides of copper foils is also available upon special request.**Physical properties of 35um Copper Foil sputtered Graphite Thermal Film
Copper foil thickness 0.035 (mm) Density 8.2 (g/cm3) Heat resistance 400(℃) Thermal Conductivity-XY axis 400↑(W/m K) Thermal Conductivity-Z axis 320↑(W/m K) Conductivity 2*106 (S/M) Bending resistance
(180 degree bending)100,000 ↑ Tensile strength
(horizontal direction)≧ 28 (Mpa) Processing merits - It can be die-cut by roll-to-roll processing and it can also save mold cost.
- It is bending-resistant and does not flaking.
- No additional film material is required
- It can be reworked.