TOP Nanometal Awarded 2026 D&B SME Elite Award in Semiconductor Sector

[TAIPEI, Taiwan – Sep. 14th, 2026] – TOP Nanometal Corporation, a leading supplier of flexible electronic and semiconductor materials, today announced that it has been awarded the prestigious "2026 Dun & Bradstreet SME Elite Award - Semiconductor Industry Award" by Dun & Bradstreet (D&B), a global leader in commercial data and analytics. This honor recognizes TOP Nanometal's outstanding performance in financial stability, export indicators, and data governance, while highlighting its technical breakthroughs and global competitiveness in semiconductor and advanced packaging materials.

Data-Driven Selection: TOP Nanometal Excels in Key Operational Metrics

The Dun & Bradstreet SME Elite Award, widely regarded as the Oscar of Taiwan's small and medium enterprises, celebrates its 13th edition under the theme "Decision AI: Winning the Future." The selection process requires no self-nomination; instead, D&B utilizes its global commercial database and AI analytics models to objectively evaluate over 1.7 million SMEs in Taiwan. Winners are selected based on key criteria including Paydex scores, financial stress indexes, ESG metrics, export tiers, and revenue growth to identify the Top 1,000 most competitive enterprises.

Introducing the "Semiconductor Industry Award" for the first time this year, D&B aims to honor companies with core technological capabilities and strong international integration in the semiconductor supply chain. With zero bounced checks, zero negative legal records, sound financial health, and robust export growth, TOP Nanometal stood out among numerous semiconductor material and equipment suppliers to earn this authoritative recognition.

Deepening R2R Vacuum Sputtering to Enable Lighter, Thinner IC Substrates and Semiconductors

Since its inception, TOP Nanometal has focused on the R&D and manufacturing of Roll-to-Roll (R2R) Vacuum Magnetron Sputtering and horizontal copper electroplating technologies. Addressing the rigorous industry demands for miniaturization, high-frequency/high-speed transmission, and superior heat dissipation, TOP Nanometal has successfully developed key materials including:

• Peelable-Type Ultra-Thin Copper Foil (3µm / 5µm) for IC Substrates: Supports mSAP (modified Semi-Additive Process) and Coreless packaging processes, enabling ultra-fine line width/space (<40µm) to significantly enhance IC substrate and advanced packaging performance and yield.

• 2-Layer Flexible Copper Clad Laminate (2L-FCCL): Offers high heat resistance, excellent peel strength, and superior flexibility, widely applied in 5G communications, automotive electronics, and flexible sensors.

• Graphite Copper Foil Composite Thermal Sheet & IC Packaging Heat Sinks: Effectively resolves thermal bottlenecks for high-power chips and electronic components.

"We are honored to receive the 2026 Dun & Bradstreet SME Elite Award - Semiconductor Industry Award," said the General Manager of TOP Nanometal Corporation. "This award validates our team's long-term commitment to material innovation and quality excellence, as well as our credibility in the global supply chain. Moving forward, TOP Nanometal will continue to advance data-driven decision-making and ESG sustainable management, delivering superior material solutions to create greater value for our global semiconductor and electronics partners."

Rooted in Taiwan, Expanding Globally: Driving Smart and Sustainable Manufacturing

Looking ahead, TOP Nanometal Corporation will continue to strengthen its R&D capabilities in advanced electronic materials, expanding into high-growth markets such as 5G/6G communications, automotive electronics, advanced packaging, and IC substrates. Concurrently, the company is committing to smart manufacturing, digital governance, and ESG green manufacturing to become the most trusted long-term strategic partner in global semiconductor and flexible electronics materials.

About TOP Nanometal Corporation Founded in 2015, TOP Nanometal Corporation is a professional manufacturer of electronic substrates and semiconductor materials. Its core technologies include Roll-to-Roll (R2R) vacuum magnetron sputtering, chemical electroforming, and horizontal copper electroplating. Key products include ultra-thin copper foil for IC substrates, 2-Layer Flexible Copper Clad Laminate (2L-FCCL), graphite copper heat dissipation films, and customized metal coating services. TOP Nanometal's products are widely used in high-end communications, consumer electronics, automotive electronics, and semiconductor packaging.

Official Website: https://topnano.com.tw/