Topnano Showcases Ultrathin Flexible Circuit Solutions at the 2025 TPCA Show

Taipei, Taiwan – September 2, 2025 –TOP Nanometal Corporation ( Topnano), a leader in advanced materials for the electronics industry, will be exhibiting its cutting-edge roll-to-roll sputtered metal film applications at the 2025 TPCA Show from October 22nd to 24th. Located on the 4th floor of the Nangang Exhibition Center at booth N122, Topnano aims to highlight its revolutionary adhesive-free flexible copper-clad laminates (FCCL) and ultra-thin copper foils, setting new standards in manufacturing flexible printed circuit boards and integrated circuit substrates.

As the demand for lightweight and flexible electronic components continues to rise, Topnano's innovative solutions address critical industry needs. The company's adhesive-free FCCL products enable the production of fine-circuit flexible printed circuits and versatile conductive films, enhancing design flexibility while reducing manufacturing complexities. Additionally, Topnano’s ultra-thin tearable copper foils are ideal for IC substrate applications and metal mesh touch sensor manufacturing, offering exceptional performance in a compact form factor.

The TPCA Show serves as a vital platform for industry leaders and innovators to connect, share insights, and explore advancements in technology. Topnano’s participation underscores its commitment to driving progress in the electronics sector through sustainable and efficient manufacturing practices. Attendees are encouraged to visit booth N122 to experience firsthand how Topnano's solutions can transform their product offerings and manufacturing processes.

About Topnano: Topnano is a pioneering manufacturer of advanced Roll to Roll Sputtered materials for the electronics industry, specializing in innovative solutions for flexible circuits and IC substrates.