Sputter type non-adhesive ultra-thin FCCL substrate: a new choice for conductivity composite materials

Under the trend of high frequency and thinness in the electronic industry, the demand for high-conductivity composite materials is challenging the performance limit of electronic components. Topnano's 2L-FCCL (Ultra Thin Copper FCCL ) can combine flexible polymer plastic substrate with copper layer to form a highly conductive composite material for application in modern electronic manufacturing.

Environmentally friendly process non-adhesive technology
Traditional FCCL substrates require adhesives to combine copper foil with substrates, but Topnano's FCCL uses roll-to-roll sputtering and copper plating thickening technology to directly form an ultra-thin copper layer of 2μm~9μm on polyimide film. This non-adhesive structure not only removes the thickness of the adhesive and reduces the concerns about melting glue under high temperature use, but also achieves an excellent bonding strength of >0.7kgf/cm between the copper layer and the substrate, showing a breakthrough in thin and light structural design.

Excellent conductive performance
As a highly conductive composite material, sputtered FCCL has a very fine grain structure in its copper layer, and the surface roughness is only about 13nm, which is much lower than that of traditional electrolytic copper and rolled copper. This ultra-smooth surface property greatly improves the signal transmission speed, meeting the strict requirements of high-speed transmission and high-frequency applications for low loss.

Precision process coordination
Topnano's FCCL is combined with the mSAP improved semi-additive process. Its ultra-thin copper layer design greatly shortens the etching time, avoids side etching problems, and realizes ultra-fine circuit design. This feature makes it an ideal material for products such as microelectronics, wearable devices, and thin and light flexible boards.

Diversified applications
In addition to flexible Printed circuit boards, Topnano's FCCL can also be used as a semi-additive material for ultra-thin conductor layers of PCBs, and even supports copper plating of transparent substrate PET films, showing unlimited possibilities in customized applications.

More product information: http://www.topnano.com.tw/en-products.php?id=67

Contact us now ! 

TOP Nanometal Corporation
Tel: +886-2-2298-3539 ext 8899
Fax: +886-2-2299-1200
Add: 7F, No. 13, Wuquan 7th Road, Wugu District, New Taipei City (Operation Headquarters)
Contact: Business Manager Joe Lin
Email: joe_lin@topnano.com.tw