Topnano accepted an Interview with TPCA Show and Introduced Super Thin Copper Foil for IC Substrate

TOP Nanometal Corporation (Topnano), a leading provider of copper foils for printed circuit boards (PCBs), today announced the launch of its new ultra-thin copper foil for IC substrates in TPCA Show 2023. The foil is only 3um thick and is suitable for prepreg substrates that use the MSAP process to form lines. It can significantly reduce the thickness and weight of IC substrates, meeting the demand for thinner and lighter end-user electronic products.

“IC substrates are used to package IC chips, and their thickness and weight directly affect the thinness of IC packaging products,” said Mr. Tsai Wen-he, Vice President of Sales at Topnano. “In recent years, as the trend of thinner and lighter end-user electronic products has accelerated, IC substrates have also gradually shifted to the direction of thinning. Topnano’s Super Thin Copper Foil for IC substrates uses a proprietary technology that can effectively reduce the thickness of copper foil while maintaining good conductivity and ease of tearing.”

Mr. Tsai pointed out that Topnano’s Super Thin Copper Foil for IC substrates has a wide range of applications, including ultra-fine circuit manufacturing of printed circuit boards, Coreless substrates, HDI high-density interconnection technology boards, etc. Topnano will continue to invest in research and development to meet customer needs and seize the market opportunity for ultra-thin copper foil for IC substrates.

According to the latest report from market research firm Prismark, the global IC substrate market is expected to reach US$17.24 billion in 2023 and US$22.33 billion in 2028. The advanced IC substrate market is expected to grow at a compound annual growth rate of 5.87%. As a key material for advanced IC substrates, the market demand for ultra-thin copper foil for IC substrates is also expected to grow accordingly.

Below is the video of this TPCA SHOW 2023 Interview, welcome to watch it (with English subtitles).