Topnano launches peelable Ultrathin Copper Foil for IC Substrate

Topnano launches peelable Ultrathin Copper Foil for IC Substrate to meet the demand for thinner and lighter terminal electronic products.

TOP Nanometal Corporation launches a new product "Super Thin Copper Foil for IC Substrate". This product uses 3um/5um-thick peelable copper foil and is suitable for the mSAP semi-additive method and coreless process in the PCB manufacturing process. It can significantly reduce the thickness and weight of PCB and IC carrier boards and meet the demand for thinner and lighter end electronic products.

Topnano's "Super Thin Copper Foil for IC Substrate" is completed by 18um carrier copper foil with PVD deposition process to produce a metal separation layer and 3um horizontal copper plating thickening technology.

This product has the following advantages:

• The thickness is only 3um/5um, which can significantly reduce the thickness and weight of IC carrier boards and PCBs, meeting the demand for thinner and lighter end electronic products.
• The line width/line spacing can reach less than 40/40, which can produce finer lines and improve the performance of PCB and IC carrier boards.
• The carrier copper foil can be peeled off to facilitate subsequent processing.

Topnano's "Super Thin Copper Foil for IC Substrate" is mainly used in IC packaging carrier boards, high-density interconnection technology boards, Coreless substrates, IC packaging process materials, etc.

As the functions of IC components tend to become more complex, the number of board layers used also increases, and the thickness and weight of PCBs also increase.

In order to meet the demand for thinner and lighter terminal electronic products, ultra-thin copper foil will become a trend in PCB manufacturing.

The launch of Topnano's "Super Thin Copper Foil for IC Substrate" will provide PCB manufacturers with thinner, lighter and higher-performance solutions.