Comparison of various common film-forming methods and the films that can be formed

The following lists several film-forming methods commonly used in the electronics industry and compares them with the films they may form.

Film formation methods include: PVD (physical vapor deposition), CVD (chemical vapor deposition), coating method, and electroplating method.

Types of films that may be formed: insulating film, metal conductor film, semiconductor film (only CVD method can be used.)

Topnano has a roll-to-roll vacuum sputtering process using the PVD method and a horizontal copper plating thickening process using the electroplating method. It can produce a series of metal foils, composite metal foils, flexible polymer substrate metallized films and other materials for the electronic industry. Welcome to inquire if you need.


 

Film formation method	PVD (physical vapor deposition)	CVD (chemical vapor deposition)	coating method	electroplating method
Basic techniques	Physical phenomenon application (evaporation, sputtering, ion implantation, etc.)	Applications of Chemical Vapor Phase Reactions. (Excitation method: heat, plasma, light, etc.)	Applications of electrochemical reactions (Electrolysis - reduction of metal ions at the cathode)	Liquid coating and hardening (Spin coating, dip coating, spray coating)
Insulating film	SiO2, Al2O3, SiN, Ferroelectric thin film... (Appropriate target materials need to be selected for sputtering and reactive sputtering)	SiO2, Si3N4, Ta2O5, Al2O3, ferroelectric thin films, low k films, and others.	一	SiO2, ferroelectric thin films, low k films,Polymer film, etc.
Metal conductor film	Aluminum film, aluminum alloy film, copper film, copper alloy film,High melting point metal, silicide (WSi2, etc.), Nitrides (TiN, etc.) and almost all other metal films.	High melting point metals (molybdenum, tungsten), aluminum films, copper films, silicides (WSi2, etc.), nitrides (TiN, etc.) and others.	Copper film, gold film, nickel film, chromium film, etc.	Copper film
Semiconductor film	一	Silicon (epitaxial layer), polysilicon, amorphous silicon	一	一
Remarks	As long as the suitable target is selected, almost all metals and insulating films can be formed. (Sputtering and Reactive Sputtering)	Almost all kinds of films can be formed as long as the raw materials can be converted into steam.	*Electroplating without electric field can also be used. *Copper-plated film is often used for assembly and printed circuit boards. *Plating of aluminum and tungsten is electrochemically impossible.	*Including coating, solvent removal process, and annealing process. It also includes two ways of dispersing or dissolving the raw materials in the solvent.