Comparison of cooling effect of sputtering different metals on copper foil

100 μ m copper foil vs 100 μ m graphite copper foil

Heat dissipation test material size: thickness 100um, size: 70mm*20mm, temperature 22 C.



The following is the experiment of comparing the cooling effect of Micron M.2.SSD with copper foil material vs copper foil sputtered graphite material made by Topnano Corp.
 
It takes about 40 minutes to write 2TB of content in a notebook computer. After sticking the 100 μm Topnano’s copper foil sputtered graphite thermal film on SSD, the cooling effect can reach about 10 degrees C.
 
Compared with the 100 μm copper foil with the same thickness, the heat dissipation effect is better. It can be seen that even if the material thickness is the same, the heat dissipation and cooling effect are obviously improved after sputtering a layer of nano-graphite.
 
Based on the material characteristics, customers are advised to use graphite copper foil with large area and thick thickness spec, which can achieve better heat dissipation/heat conduction effect for your product.
 
 

 Heat dissipation test experimental summary: 
 
1. Compared with pure copper foil, the cooling effect after sputtering nano graphite/nickel chromium and other metals is better than that of pure copper foil.

2. When the writing capacity exceeds 800GB, the cooling effect of graphite copper foil is much better than other materials.

3. The cooling and heat dissipation effect of pure copper foil will decrease with time.

4. The longer the graphite copper foil runs, the better the heat dissipation effect will be.

5. after long-term use, the heat dissipation effect of graphite copper foil can be improved by 40 ~ 70% compared with pure copper foil, and can be reduced by about 4 degrees C.

< Note: The following is the measuring machine information and measuring methods >