Sputtering Technology Introduction

Sputtering, also known as sputter deposition, is a physical vapor deposition (PVD) technology, which refers to the physical process in which atoms in a solid target are hit by high-energy ions (usually from plasma) and leave the solid target to enter the gas.

Sputtering is generally in a vacuum system filled with inert gas, through the action of a high-voltage electric field, argon (Ar) is ionized to generate an argon ion flow, which bombards the target cathode, and the sputtered target atoms or molecules precipitate and accumulate in the Thin films are formed on semiconductor wafers or glass and ceramics.



* Topnano's sputtering products are roughly divided into 2 categories:

1. Deposit the metal/alloy on the metal target on the plastic substrate (for example: PI film/PET film) by sputtering technology.

  Product examples: Ultra Thin FCCL(2L-FCCL), ITO transparent conductive film.

2. Use metal foil (for example: copper foil, aluminum foil) as the substrate, and sputter a layer of other metals/alloys on it to make electronic materials.

    Product Example: Copper Foil sputtered Graphite Thermal Film

*Topnano can also provide the above two types of sputtering OEM services, for details, please refer to:
https://www.topnano.com.tw/en-products.php?id=68

*More information about Roll to Roll Sputtering, please refer to: https://www.topnano.com.tw/en-qa.php