Top Nanometal Corp.’s roll-to-roll vacuum sputtering process and chemical copper plating process can produce a series of metal-clad thin films, flexible electrode materials and transparent conductive films.

Roll-to-roll sputtering technology has a wide range of applications and can prepare large-area, uniform-thickness films. In addition, the quality of sputtered thin films is superior to evaporation technology in some aspects, such as adhesion and corrosion resistance.

For example, for coatings that require emphasis on peel strength (tensile strength), sputtering method is recommended to meet the requirements.

* The thickness of the metal coating is only nanometer (~ 150 nm).
* Only Cu plating can support Single-sided up to 18um thickness.

According to the type of material, we can provide two kinds of OEMs.

1. Metallized polymer film 
The metal/alloy is deposited on the polymer substrate (e.g. PI Film /PET Film) from metal target.

*Products Examples : 2L-FCCL,  ITO transparent conductive film

2. Composite metal foil. 

Metal foil (e.g. Cu Foil) is used as a substrate and other metals/alloys are sputtered on top to make electronic materials.

*Product example : Copper Foil sputtered Graphite Thermal Film


"Overview of sputtering thin film products"

• Usage: Flexible circuit board materials, touch panel or display materials, Flexible electrode materials...
• Substrate: PET Film/PI Film/Copper foil/Aluminum Foil and other thin metal or flexible ThermoPlastic materials
• Substrate thickness: 12.5 um~250 um
• Copper plating thickness: 2um~8um on both sides or 2um~18um on Single Side
• Sputtering of other metals: Metal layer thickness up to 200 nm, depending on material properties
• Roll width: 500 mm
• Length: 100-200 M
• Minimum order quantity: 1 roll (=100M)

Taking copper-clad film as an example, copper ions are dissociated from targets and uniformly deposited on plastic substrates (e.g. PI, PET Film) to form a layer of dense metal-clad film. Copper-clad films by vacuum sputtering process have merits such as good uniformity of metal layer, productive, good adhesion, and high hardness.

Two-layer non-adhesive ultra-thin flexible copper clad laminate (sputtering FCCL, copper layer thickness ranges from 2um to 8um) produced by vacuum sputtering and chemical processes is an important FCCL substrate for fine pitch FPC design of 5G era.

We can provide various metal sputtering OEM services by customer needs, such as sputtering graphite on aluminum, and sputtering copper on PI and PET.

The regular used metal targets in our factory include: Cu, NiCr, NiCu, NiCuTi, C, Si, ITO targets.
If you have other metal sputtering needs, such as Al, Ag, welcome to contact us for discussion. For new project purpose, we can purchase metal targets by needs.

*PET Film Sputter Copper materials Application : FPC, 5G Antenna, eTag, Transparent LED Display ,Metal Mesh etc.

In response to customer needs, we have developed Single Side 9um to 18um Copper Film with PET substrate. If you are interested this kind materials, please feel free to contace us.
 

*Product application includes: EMI Shielding films, Transparent Conductive Films, graphite heat dissipation film,Thin Film Heater, etc.

*For more knowledge about roll-to-roll sputtering materials, please refer to the  knowledge area of this website.