Topnano to Discontinue ITO Film Production, Expanding Capacity for Sputtered Copper film

[NEW TAIPEI CITY, June. 17, 2026] – TOP Nanometal Corp. (Topnano), a leading Taiwan-based manufacturer specializing in Roll-to-Roll (RTR) vacuum sputtering coating, today announced its 2026 strategic transformation plan. To optimize its product portfolio, the company will cease production of ITO (Indium Tin Oxide) Film effective immediately. Production capacity will be fully transitioned to high-end sputtered copper product lines, focusing on the markets for adhesive-less FCCL (Flexible Copper Clad Laminate) and thin copper films for electronic conduction.

TOP Nanometal stated that in response to intensifying competition and thinning profit margins in the ITO film market, the company has decided to re-engineer and optimize its ITO sputtering equipment for copper production. This shift is driven by increasing customer demand and superior profitability in the copper segment. Benefiting from innovations in 5G communications, automotive electronics, and LED transparent display technologies, the market for high-performance adhesive-less FCCL and thin copper films is experiencing explosive growth. Following the equipment upgrades, TOP Nanometal is now capable of producing polymer-based sputtered copper films that are thinner, offer stronger adhesion, and demonstrate excellent thermal stability.

"We are redirecting our resources from a 'Red Ocean' of fierce price wars to a high-growth 'Blue Ocean'," said the spokesperson for TOP Nanometal Corp. "Through this precision transformation, we are not only meeting the precise circuitry requirements of LED transparent displays but also providing flexible printed circuit (FPC) customers with more competitive key substrates."

This transition marks TOP Nanometal’s evolution from a general material supplier to a strategic technical partner for high-end circuit applications, continuing to drive advancement within the flexible electronics industry.