Evaporation VS Sputtering for comparison of Thin film deposition

Evaporation and sputtering are common thin film deposition techniques, and they have the following differences:

The coating principles of evaporation and sputtering are different:
Evaporation plating is to use heat energy or electron beam to heat the plating material to sublimation or ionization, and then deposit it on the substrate to form a film.
Sputtering is to bombard the plating material with ion beam to form an ionic state, and then deposit it on the substrate by electric field to form a film.

The process characteristics of evaporation and sputtering are different:
Evaporation technology can prepare high purity, high density and high flatness films, which are suitable for high-grade glass, optical devices, integrated circuits and other industries.
Sputtering technology has a wide range of applications, and it can prepare films with large area and uniform thickness, and its film quality is better than evaporation technology in some aspects, such as adhesion and corrosion resistance.

The coating material restrictions for evaporation and sputtering are different:
Evaporation technology can be used to coat a variety of materials, such as metals, oxides, sulfides, nitrides and so on.
Sputtering technology is usually only suitable for coating metal, plastic and oxide materials.

TOP Nanometal Corp. is a manufacturer with roll-to-roll sputtering and horizontal copper plating technology as its core. We provide roll-to-roll sputtering OEM services for flexible materials. Welcome to inquire.

*For more Q&A about roll-to-roll sputtering, please see the FAQ at the top of the official website