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- Ultra Thin FCCL
(2L-FCCL) - ITO Transparent Film
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- Copper Foil sputtered Graphite Thermal Film
- Super Thin Copper Foil for IC substrate
- Ultra Thin FCCL
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Ultra Thin Copper FCCL (2L-FCCL)
Product Overview:Sputter Type FCCL (Flexible Copper Clad Laminate) is a key upstream material for Flexible Printed Circuits (FPCs) and Rigid-flex boards. Our innovative product offers superior performance for advanced FPC manufacturing and suitable for Fine-line layout design.
Product Features:-
Key Material for Flexible Printed Circuit & Rigid-Flex Boards: This product serves as one of the primary upstream materials for both Flexible Printed Circuits (FPC) and Rigid-Flex boards.
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Adhesive-Free 2-Layer FCCL: Our 2-layer FCCL is free from adhesive between the PI (Polyimide) and copper, making it ideal for advanced FPC manufacturing, including Fine Line FPCs and tape COF FCCLs.
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Advanced Manufacturing Process: Produced using Roll-to-Roll vacuum sputtering and chemical electroforming (electroplating) processes, ensuring high-quality copper layers.
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Versatile Copper Thickness: With copper thickness ranging from 2μm to 8μm, our FCCL is suitable for Fine Line layout designs. The single-sided copper layer can be extended up to 9μm to 18μm.
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Customizable for Thick Copper Applications: For customers needing FCCL with copper thicker than 35μm, our 8μm products can be further plated with copper to achieve the desired thickness.
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Optimized for mSAP Modified Semi-Additive Process: This FCCL supports the mSAP process for flash etching, minimizing lateral etching and reducing etching time.
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Ideal for PCB Circuit Boards: Our 2μm FCCL products can also serve as semi-build-up materials for PCB circuit boards, acting as a metal seed layer (metal conductor layer).
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Superior Grain Analysis: The crystalline particles, pores, and surface roughness (Rq) of our copper layer are smaller and more uniform than those found in ED Copper and RA Copper, resulting in a smoother material surface.
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RoHS Compliant: This product meets the RoHS (Restriction of Hazardous Substances) compliance standards, ensuring it is environmentally friendly.
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Recommended Etching Process: For etching, we recommend using Copper(II) chloride (CuCl2) Etching Liquid or laser engraving to create the required lines.
Why Choose Our Sputter Type FCCL?
- High-performance for advanced FPC applications
- Flexible thickness options for diverse needs
- Superior surface quality for enhanced conductivity
- Environmentally friendly and compliant
- Compatible with cutting-edge manufacturing processes
Product Advantages:
◎Effectively reducing copper etching residues problems which normally happen on 3L-FCCLs.
◎Material characteristics are similar to ED Copper, but the etching time is shorter, which can save 20% of the etching time.
◎High heat resistance, fine flexural/bending endurance, good peel strength, copper layer uniformity, and dimensional stability.
Especially recommended to the following types of FPC Process customers:1.Customers who are troubled by current FCCL stack-up(PI and copper layer thickness),and want to use thinner materials to meet the latest design trend of small, short and light-weighted for electronic products.
2.Customers who use the method of "selective copper plating” in the Pattern Process.
(Our FCCL copper layer is very thin, which can shorten process time and risk of undercut during patterning.)
** For Each Spec Introduction and catalogue, please refer to <topnano in Taiwantrade>
URL:https://topnano.en.taiwantrade.com>
More knowledge and applications about sputtering adhesive-free FCCL:- Transparent LED Film Screen Circuit material 2Layer PET Copper Film
- Copper Foil Surface Roughness and Its Impact on PCB and 5G High-Speed Transmission
- Seed layer in the sputtering material plays a key role as the "glue"
- Intro of Roll-to-Roll vacuum sputtering conductive materials (Cu/Al /ITO/ Graphite)
- PCB Copper ED Cu vs Ra Cu vs Sputter with Plating Cu
*Most people are not familiar with sputtering with plating copper. Please click on the underlined text above to view the information.Application (Final products):
*Wearable devices : smart watches, wireless bluetooth earphone, Sports bracelet...
*Smart phones
*OLED display
*Smart Car devices
*EMI Shielding Film
*Antenna
*5G Application products
*Internet of Things( IOT) Application products
*Polyimide film heaters (Thin Film Heater)
* COF CHIP HEAT SINK
Ultra Thin FCCL
(Single Side)- 型號
(Item No.) - 材料厚度
(PI Film) - 銅層厚度
(Cu layer) - 寬幅
(Width) - 長度
(Length) - 型號
(Item No.) - FCS025KA1-T02
- 材料厚度
(PI Film) - 25 um
- 銅層厚度
(Cu layer) - 2 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
- 型號
(Item No.) - FCS025KA1-T05
- 材料厚度
(PI Film) - 25 um
- 銅層厚度
(Cu layer) - 5 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
- 型號
(Item No.) - FCS038DU1-T02
- 材料厚度
(PI Film) - 38 um
- 銅層厚度
(Cu layer) - 2 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
- 型號
(Item No.) - FCS038DU1-T05
- 材料厚度
(PI Film) - 38 um
- 銅層厚度
(Cu layer) - 5 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
- 型號
(Item No.) - FCS038DU1-T08
- 材料厚度
(PI Film) - 38 um
- 銅層厚度
(Cu layer) - 8 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
- 型號
(Item No.) - FCS050DU2-T02
- 材料厚度
(PI Film) - 50 um
- 銅層厚度
(Cu layer) - 2 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
- 型號
(Item No.) - FCS050DU2-T05
- 材料厚度
(PI Film) - 50 um
- 銅層厚度
(Cu layer) - 5 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
- 型號
(Item No.) - FCS050DU2-T08
- 材料厚度
(PI Film) - 50 um
- 銅層厚度
(Cu layer) - 8 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
MOQ : 1 Roll (=100M)
Ultra Thin FCCL
(Double Side)- 型號
(Item No.) - 材料厚度
(PI Film) - 銅層厚度
(Cu layer) - 寬幅
(Width) - 長度
(Length) - 型號
(Item No.) - FCD025KA1-T02
- 材料厚度
(PI Film) - 25 um
- 銅層厚度
(Cu layer) - 2 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
- 型號
(Item No.) - FCD025KA1-T05
- 材料厚度
(PI Film) - 25 um
- 銅層厚度
(Cu layer) - 5 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
- 型號
(Item No.) - FCD025KA1-T08
- 材料厚度
(PI Film) - 25 um
- 銅層厚度
(Cu layer) - 8 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
- 型號
(Item No.) - FCD038DU1-T02
- 材料厚度
(PI Film) - 38 um
- 銅層厚度
(Cu layer) - 2 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
- 型號
(Item No.) - FCD038DU1-T05
- 材料厚度
(PI Film) - 38 um
- 銅層厚度
(Cu layer) - 5 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
- 型號
(Item No.) - FCD038DU1-T08
- 材料厚度
(PI Film) - 38 um
- 銅層厚度
(Cu layer) - 8 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
- 型號
(Item No.) - FCD050DU2-T02
- 材料厚度
(PI Film) - 50 um
- 銅層厚度
(Cu layer) - 2 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
- 型號
(Item No.) - FCD050DU2-T05
- 材料厚度
(PI Film) - 50 um
- 銅層厚度
(Cu layer) - 5 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
- 型號
(Item No.) - FCD050DU2-T08
- 材料厚度
(PI Film) - 50 um
- 銅層厚度
(Cu layer) - 8 um
- 寬幅
(Width) - 500 mm
- 長度
(Length) - 100~200M
MOQ : 1 Roll (=100M)
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