￭ Super Thin Copper Foil for IC substrate is 3um copper which covered with 18um copper foil. It is extremely easy to peel off once apply.
￭ Suitable for mSAP semi-additive process, can be used as thin circuit substrate application.
￭ The metal releasing layer + 3um electroforming copper is generated by physical production procedure on 18um copper foil substrate.
￭Suitable for IC Substrate, high-density interconnect technology boards, IC package process materials, etc.
￭ Comply with RoHS and Reach specifications


Super Thin copper foil with carrier is mainly used for IC Substrate which are formed by MSAP process.

The thickness of ultra-thin copper foil for IC Substrate is generally between 2um and 5um. In the initial stage, Topnano’s Super Thin Copper Foil for IC Substrate products will mainly be 3um products for promotion and use.

Topnano's Super Thin Copper Foil for IC Substrate is made up of 18um carrier copper foil and peelable ultra-thin copper foil.

Generally, after laminating the adhesive film on the copper carrier board, the customer will remove the 18um copper carrier foil, leaving only the ultra-thin peelable copper in the IC Substrate to be used as the copper seed layer.

In recent years, as IC component functions have become more complex, the number of board layers used has increased.

If end-products continue to move toward thinner and lighter designs, the limited space inside the equipment will drive more PCB processes to use ultra-thin copper foils.

In addition to the layering process, the copper-clad substrate, which is the core layer, may also use ultra-thin copper foil in the future to satisfy the trend of equipment thinning.
 Composition 



 Usage (for reference only)

In PCB manufacturing process, 18um copper foil is laminated with various resin substrates including Prepreg to form CCL, and then the 18um copper foil is torn off.

In PCB manufacturing process, after etching process to make the proper circuit, then press the 18um carrier copper foil with Prepreg or other resin substrate to form CCL, and then separate the 18um carrier copper foil.